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? semiconductor components industries, llc, 2017 january, 2017 ? rev. 2 1 publication order number: noa2301/d noa2301 digital proximity sensor with interrupt description the noa2301 combines an advanced digital proximity sensor and led driver coupled with a tri?mode i 2 c interface with interrupt capability in an integrated monolithic device. multiple power management features and very low active sensing power consumption directly address the power requirements of battery operated mobile phones and mobile internet devices. the proximity sensor measures reflected light intensity with a high degree of precision and excellent ambient light rejection. the noa2301 enables a proximity sensor system with a 16:1 programmable led drive current range and a 30 db overall proximity detection range. the noa2301 is ideal for improving the user experience by enhancing the screen interface with the ability to measure distance for near/far detection in real time. features ? proximity sensor and led driver in one device ? proximity detection distance threshold i 2 c programmable with 12?bit resolution and eight integration time ranges (16?bit effective resolution) ? effective for measuring distances up to 200 mm and beyond ? excellent ir and ambient light rejection including sunlight (up to 50k lux) and cfl interference ? programmable led drive current from 10 ma to 160 ma in 5 ma steps, no external resistor required ? user programmable led pulse frequency ? very low power consumption ? stand?by current 2.8 a (monitoring i 2 c interface only, vdd=3v) ? proximity sensing average operational current 100 a ? average led sink current 75 a ? programmable interrupt function including independent upper and lower threshold detection or threshold based hysteresis ? level or edge triggered interrupts ? proximity persistence feature reduces interrupts by providing hysteresis to filter fast transients such as camera flash ? automatic power down after single measurement or continuous measurements with programmable interval time ? wide operating voltage range (2.3 v to 3.6 v) ? wide operating temperature range (?40 c to 80 c) ? i 2 c serial communication port ? standard mode ? 100 khz ? fast mode ? 400 khz ? high speed mode ? 3.4 mhz ? no external components required except the ir led and power supply decoupling caps ? these devices are pb?free, halogen free/bfr free and are rohs compliant applications ? senses human presence in terms of distance for saving display power and preventing inadvertent command initiation in applications such as: ? smart phones, mobile internet devices, mp3 players, gps ? mobile device displays and backlit keypads ? headphone use detection ? cameras ? game controllers, media players ? contactless switches ? touch?less switches for light controls ? money detection, coin or paper ? sanitary switches for medical environments cudfn8 cu suffix case 505ap www. onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. *temperature range: ?40 c to 80 c. device package shipping ? ordering information noa2301cutag* cudfn8 (pb?free) 2500 / tape & reel pin connections 1 2 3 6 5 7 vdd led_gnd led scl sda nc (top view) int vss 4 8 1
noa2301 www. onsemi.com 2 figure 1. noa2301 application block diagram adc h proximity ir diode sda scl int dsp osc i 2 c interface & control led ir led vdd vdd_i2c sda scl int mcu noa2301 vdd vss vss_led led drive 22 f 0.01 f 1 f table 1. pad function description pad pad name description 1 vdd power pad 2 vss ground pad 3 led_gnd ground pad for ir led driver 4 led ir led output pad 5 int interrupt output pad, open?drain 6 sda bi?directional data signal for communications with the i2c master 7 scl external i2c clock supplied by the i2c master
noa2301 www. onsemi.com 3 table 2. absolute maximum ratings rating symbol value unit input power supply vdd 4.0 v input voltage range v in ?0.3 to vdd + 0.2 v output voltage range v out ?0.3 to vdd + 0.2 v maximum junction temperature t j(max) 100 c storage temperature t stg ?40 to 80 c esd capability, human body model (note 1) esd hbm 2 kv esd capability, charged device model (note 1) esd cdm 500 v moisture sensitivity level msl 3 ? lead temperature soldering (note 2) t sld 260 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. this device incorporates esd protection and is tested by the following methods: esd human body model tested per eia/jesd22?a114 esd charged device model tested per esd?stm5.3.1?1999 latchup current maximum rating: 100 ma per jedec standard: jesd78 2. for information, please refer to our soldering and mounting techniques reference manual, solderrm/d table 3. operating ranges rating symbol min typ max unit power supply voltage vdd 2.3 3.6 v power supply current, stand?by mode (vdd = 3.0 v) idd stby 2.8 5 a power supply average current, ps operating 300 s integration time and 100 ms intervals idd ps 47 100 a led average sink current, ps operating at 300 s integration time and 100 ms intervals and led current set at 50 ma i led 75 a i 2 c signal voltage (note 3) vdd_i2c 1.6 1.8 2.0 v low level input voltage (vdd_i2c related input levels) v il ?0.3 0.3 vdd_i2c v high level input voltage (vdd_i2c related input levels) v ih 0.7 vdd_i2c vdd_i2c + 0.2 v hysteresis of schmitt trigger inputs v hys 0.1 vdd_i2c v low level output voltage (open drain) at 3 ma sink current (int) v ol 0.2 vdd_i2c v input current of io pin with an input voltage between 0.1 vdd and 0.9 vdd i i ?10 10 a output low current (int) i ol 3 ? ma operating free?air temperature range t a ?40 80 c functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability. 3. the i 2 c interface is functional to 3.0 v, but timing is only guaranteed up to 2.0 v. high speed mode is guaranteed to be functional t o 2.0 v.
noa2301 www. onsemi.com 4 table 4. electrical characteristics (unless otherwise specified, these specifications apply over 2.3 v < vdd < 3.6 v, 1.7 v < vdd_i2c < 1.9 v, ?40 c < t a < 80 c, 10 pf < cb < 100 pf) (see note 4) parameter symbol min typ max unit led pulse current i led_pulse 10 160 ma led pulse current step size i led_pulse_step 5 ma led pulse current accuracy i led_acc ?20 +20 % interval timer tolerance to l f_timer ?35 +35 % edge triggered interrupt pulse width pw int 50 s scl clock frequency f scl_std 10 100 khz f scl_fast 100 400 f scl_hs 100 3400 hold time for start condition. after this period, the first clock pulse is generated. t hd;sta_std 4.0 ? s t hd;sta_fast 0.6 ? t hd;sta_hs 0.160 ? low period of scl clock t low_std 4.7 ? s t low_fast 1.3 ? t low_hs 0.160 ? high period of scl clock t high_std 4.0 ? s t high_fast 0.6 ? t high_hs 0.060 ? sda data hold time t hd;dat_d_std 0 3.45 s t hd;dat_d_fast 0 0.9 t hd;dat_d_hs 0 0.070 sda data set?up time t su;dat_std 250 ? ns t su;dat_fast 100 ? t su;dat_hs 10 rise time of both sda and scl (input signals) (note 5) t r_input_std 20 1000 ns t r_input_fast 20 300 t r_input_hs 10 40 fall time of both sda and scl (input signals) (note 5) t f_input_std 20 300 ns t f_input_fast 20 300 t f_input_hs 10 40 rise time of sda output signal (note 5) t r_out_std 20 300 ns t r_out_fast 20 + 0.1 cb 300 t r_out_hs 10 80 fall time of sda output signal (note 5) t f_out_std 20 300 ns t f_out_fast 20 + 0.1 cb 300 t f_out_hs 10 80 set?up time for stop condition t su;sto_std 4.0 ? s t su;sto_fast 0.6 ? t su;sto_hs 0.160 ? 4. refer to figure 2 and figure 3 for more information on ac characteristics. 5. the rise time and fall time are dependent on both the bus capacitance (cb) and the bus pull?up resistor r p. max and min pull?up resistor values are determined as follows: r p(max) = t r (max) /(0.8473 x cb) and r p(min) = (vdd_i2c ? v ol(max) )/i ol . 6. cb = capacitance of one bus line, maximum value of which including all parasitic capacitances should be less than 100 pf. bus capacitance up to 400 pf is supported, but at relaxed timing.
noa2301 www. onsemi.com 5 table 4. electrical characteristics (unless otherwise specified, these specifications apply over 2.3 v < vdd < 3.6 v, 1.7 v < vdd_i2c < 1.9 v, ?40 c < t a < 80 c, 10 pf < cb < 100 pf) (see note 4) parameter unit max typ min symbol bus free time between stop and start condition t buf_std 4.7 ? s t buf_fast 1.3 ? t buf_hs 0.160 ? capacitive load for each bus line (including all parasitic capacitance) (note 6) c b 10 100 pf noise margin at the low level (for each connected de- vice ? including hysteresis) v nl 0.1 vdd ? v noise margin at the high level (for each connected de- vice ? including hysteresis) v nh 0.2 vdd ? v 4. refer to figure 2 and figure 3 for more information on ac characteristics. 5. the rise time and fall time are dependent on both the bus capacitance (cb) and the bus pull?up resistor r p. max and min pull?up resistor values are determined as follows: r p(max) = t r (max) /(0.8473 x cb) and r p(min) = (vdd_i2c ? v ol(max) )/i ol . 6. cb = capacitance of one bus line, maximum value of which including all parasitic capacitances should be less than 100 pf. bus capacitance up to 400 pf is supported, but at relaxed timing. product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. table 5. optical characteristics (unless otherwise specified, these specifications are for vdd = 3.0 v, t a = 25 c)(note 7) parameter symbol min typ max unit detection range, tint = 4800 s, i led = 160 ma, 860 nm ir led (os- ram sfh4650), white reflector (rgb = 220, 224, 223), led modula- tion frequency = 308 khz, sample delay = 250 ns, snr = 7:1 d ps_4800_white_ mod 200 mm detection range, tint = 4800 s, i led = 160 ma, 860 nm ir led (os- ram sfh4650), white reflector (rgb = 220, 224, 223), snr = 8:1 d ps_4800_white_ 160 148 mm detection range, tint = 4800 s, i led = 25 ma, 860 nm ir led (os- ram sfh4650), white reflector (rgb = 220, 224, 223), snr = 8:1 d ps_4800_white_ 25 66 mm detection range, tint = 2400 s, i led = 50 ma, 860 nm ir led (os- ram sfh4650), white reflector (rgb = 220, 224, 223), snr = 8:1 d ps_2400_white_ 25 80 mm detection range, tint = 1800 s, i led = 75 ma, 860 nm ir led (os- ram sfh4650), white reflector (rgb = 220, 224, 223), snr = 8:1 d ps_1800_white_ 75 88 mm detection range, tint = 1200 s, i led = 100 ma, 860 nm ir led (os- ram sfh4650), white reflector (rgb = 220, 224, 223), snr = 8:1 d ps_1200_white_ 100 90 mm detection range, tint = 600 s, i led = 125 ma, 860 nm ir led (os- ram sfh4650), white reflector (rgb = 220, 224, 223), snr = 8:1 d ps_600_white_ 125 88 mm detection range, tint = 600 s, i led = 100 ma, 860 nm ir led (os- ram sfh4650), white reflector (rgb = 220, 224, 223), snr = 8:1 d ps_600_white_ 100 76 mm detection range, tint = 300 s, i led = 150 ma, 860 nm ir led (os- ram sfh4650), white reflector (rgb = 220, 224, 223), snr = 8:1 d ps_300_white_ 150 74 mm detection range, tint = 300 s, i led = 100 ma, 860 nm ir led (os- ram sfh4650), white reflector (rgb = 220, 224, 223), snr = 8:1 d ps_300_white_ 100 62 mm detection range, tint = 150 s, i led = 100 ma, 860 nm ir led (os- ram sfh4650), white reflector (rgb = 220, 224, 223), snr = 8:1 d ps_150_white_ 100 48 mm detection range, tint = 1200 s, i led = 100 ma, 860 nm ir led (os- ram sfh4650), grey reflector (rgb = 162, 162, 160), snr = 6:1 d ps_1200_grey_ 100 64 mm detection range, tint = 2400 s, i led = 150 ma, 860 nm ir led (os- ram sfh4650), black reflector (rgb = 16, 16, 15), snr = 6:1 d ps_2400_black_ 150 36 mm saturation power level p dmax 0.8 mw/cm 2 measurement resolution, tint = 150 s mr 150 11 bits 7. measurements performed with default modulation frequency and sample delay unless noted.
noa2301 www. onsemi.com 6 table 5. optical characteristics (unless otherwise specified, these specifications are for vdd = 3.0 v, t a = 25 c)(note 7) parameter unit max typ min symbol measurement resolution, tint = 300 s mr 300 12 bits measurement resolution, tint = 600 s mr 600 13 bits measurement resolution, tint = 1200 s mr 1200 14 bits measurement resolution, tint = 1800 s mr 1800 15 bits measurement resolution, tint = 2400 s mr 2400 15 bits measurement resolution, tint = 3600 s mr 3600 16 bits measurement resolution, tint = 4800 s mr 4800 16 bits 7. measurements performed with default modulation frequency and sample delay unless noted. figure 2. ac characteristics, standard and fast modes figure 3. ac characteristics, high speed mode
noa2301 www. onsemi.com 7 typical characteristics figure 4. ps response vs. distance and led current (1200 s integration time, white reflector (rgb = 220, 224, 223)) figure 5. ps response vs. distance and led current (1200 s integration time, grey reflector (rgb = 162, 162, 160)) distance (mm) distance (mm) 250 200 150 100 50 0 0 2k 4k 6k 8k 12k 14k 16k 200 150 100 50 0 0 1k 2k 4k 5k 6k 8k 9k figure 6. ps response vs. distance and led current (1200 s integration time, black reflector (rgb = 16, 16, 15)) figure 7. ps response vs. distance and integration time (80 ma led current, white reflector (rgb = 220, 224, 223)) distance (mm) distance (mm) 200 150 100 50 0 0 200 400 600 800 1000 1200 250 200 150 100 50 0 0 5k 15k 20k 25k 30k 40k 45k ps count ps count ps count ps count 10k 3k 7k 10k 35k 160 ma 80 ma 40 ma 20 ma 10 ma 160 ma 80 ma 40 ma 20 ma 10 ma 160 ma 80 ma 40 ma 20 ma 10 ma 4800 s 2400 s 1200 s 600 s 300 s 150 s figure 8. ps response vs. distance and supply voltage (1200 s integration time, 40 ma led current, white reflector (rgb = 220, 224, 223)) figure 9. ps ambient rejection (1200 s integration time, 100 ma led current, white reflector (rgb = 220, 224, 223)) distance (mm) distance (mm) 250 200 150 100 50 0 0 500 1000 1500 2000 2500 3000 3500 250 200 150 100 50 0 0 500 1000 1500 2000 2500 ps count ps count 2.3 v 3.0 v 3.6 v ambient cfl 3000k (2klux) halogen (40klux) incandescent (6klux) white led (7klux)
noa2301 www. onsemi.com 8 typical characteristics figure 10. supply current vs. supply voltage tint = 300 s, tr = 100 ms figure 11. supply current vs. supply voltage tint = 1200 s, tr = 50 ms v dd (v) v dd (v) 4.0 3.5 3.0 2.5 2.0 0 5 10 15 20 25 3.8 2.6 2.4 2.2 2.0 0 20 40 80 100 120 160 180 i dd ( a) i dd ( a) 3.2 3.0 2.8 3.6 3.4 60 140
noa2301 www. onsemi.com 9 description of operation proximity sensor architecture noa2301 combines an advanced digital proximity sensor, led driver and a tri?mode i 2 c interface as shown in figure 1. the led driver draws a modulated current through the external ir led to illuminate the target. the led current is programmable over a wide range. the infrared light reflected from the target is detected by the proximity sensor photo diode. the proximity sensor employs a sensitive photo diode fabricated in on semiconductor?s standard cmos process technology. the modulated light received by the on?chip photodiode is converted to a digital signal using a variable slope integrating adc with a default resolution (at 300 s) of 12?bits, unsigned. the signal is processed to remove all unwanted signals resulting in a highly selective response to the generated light signal. the final value is stored in the ps_data register where it can be read by the i 2 c interface. proximity sensor led frequency and delay settings the led current modulation frequency is user selectable from approximately 128 khz to 2 mhz using the ps_led_ frequency register. an internal precision 4 mhz oscillator provides the frequency reference. the 4 mhz clock is divided by the value in register 0x0d to determine the pulse rate. the default is 0x10 (16) which results in an led pulse frequency of 250 khz (4 s period). values below 200 khz and above 1 mhz are not recommended. switching high led currents can result in noise injected into the proximity sensor receiver causing inaccurate readings. the ps receiver has a user programmable delay from the led edge to when the receiver samples the data (ps_sample_delay ? register 0x0e). longer delays may reduce the effect of switching noise but also reduce the sensitivity. since the value of the delay is dependent on the pulse frequency, its value must be carefully computed. the value obviously cannot exceed the led pulse width or there would be no sampling of the data when the led is illuminated. there is also a minimum step size of 125 ns. the delay values are programmed as follows: 0 or 1: no delay 2?31: selects (n?1)*125 ns n must be less than or equal to the ps_led_frequency value the default delay is 0x05 (500 ns) table 6 shows some common led pulse frequencies and sample delays and the resulting register values. table 6. common led pulse frequency settings led pulse frequency (khz) sample delay (ns) ps_led_ frequency register (0x0d) value ps_sample_ delay register (0x0e) value 200 250 0x14 0x03 200 500 0x14 0x05 200 750 0x14 0x07 250 250 0x10 0x03 250 500 0x10 0x05 500 250 0x08 0x03 500 500 0x08 0x05 1000 250 0x04 0x03 i 2 c interface the noa2301 acts as an i 2 c slave device and supports single register and block register read and write operations. all data transactions on the bus are 8 bits long. each data byte transmitted is followed by an acknowledge bit. data is transmitted with the msb first. 788 a[6:0] d[7:0] d[7:0] write ack ack ack device address register address register data start condition stop condition 011 0111 0 0 0000 0000 0000 0110 00 0x6e figure 12. i 2 c write command figure 12 shows an i 2 c write operation. write transactions begin with the master sending an i 2 c start sequence followed by the seven bit slave address (noa2301 = 0x37) and the write(0) command bit. the noa2301 will acknowledge this byte transfer with an appropriate ack. next the master will send the 8 bit register address to be written to. again the noa2301 will acknowledge reception with an ack. finally, the master will begin sending 8 bit data segment(s) to be written to the noa2301 register bank. the noa2301 will send an ack after each byte and increment the address pointer by one in preparation for the next transfer. write transactions are terminated with either an i 2 c stop or with another i 2 c start (repeated start). figure 13 shows an i 2 c read command sent by the master to the slave device. read transactions begin in much the same manner as the write transactions in that the slave address must be sent with a write(0) command bit.
noa2301 www. onsemi.com 10 788 a[6:0] d[7:0] d[7:0] write ack ack ack device address register address register data start condition stop condition 011 0111 0 0 0000 0000 0000 0110 00 0x6e 788 a[6:0] d[7:0] d[7:0] read ack ack nack device address register data [a] register data [a+1] start condition stop condition 011 0111 1 0 bbbb bbbb bbbb bbbb 01 0x6f figure 13. i 2 c read command after the noa2301 sends an ack, the master sends the register address as if it were going to be written to. the noa2301 will acknowledge this as well. next, instead of sending data as in a write, the master will re?issue an i 2 c start (repeated start) and again send the slave address and this time the read(1) command bit. the noa2301 will then begin shifting out data from the register just addressed. if the master wishes to receive more data (next register address), it will ack the slave at the end of the 8 bit data transmission, and the slave will respond by sending the next byte, and so on. to signal the end of the read transaction, the master will send a nack bit at the end of a transmission followed by an i 2 c stop. the noa2301 also supports i 2 c high?speed mode. the transition from standard or fast mode to high?speed mode is initiated by the i 2 c master. a special reserve device address is called for and any device that recognizes this and supports high speed mode immediately changes the performance characteristics of its i/o cells in preparation for i 2 c transactions at the i 2 c high speed data protocol rates. from then on, standard i 2 c commands may be issued by the master, including repeated start commands. when the i 2 c master terminates any i 2 c transaction with a stop sequence, the master and all slave devices immediately revert back to standard/fast mode i/o performance. by using a combination of high?speed mode and a block write operation, it is possible to quickly initialize the noa2301 i 2 c register bank. noa2301 data registers noa2301 operation is observed and controlled by internal data registers read from and written to via the external i 2 c interface. registers are listed in table 7. default values are set on initial power up or via a software reset command (register 0x01). the i 2 c slave address of the noa2301 is 0x37. table 7. noa2301 data registers address type name description 0x00 r part_id noa2301 part number and revision ids 0x01 rw reset software reset control 0x02 rw int_config interrupt pin functional control settings 0x0d rw ps_led_frequency ps led pulse frequency 0x0e rw ps_sample_delay ps sample delay 0x0f rw ps_led_current ps led pulse current 0x10 rw ps_th_up_msb ps interrupt upper threshold, most significant bits 0x11 rw ps_th_up_lsb ps interrupt upper threshold, least significant bits 0x12 rw ps_th_lo_msb ps interrupt lower threshold, most significant bits 0x13 rw ps_th_lo_lsb ps interrupt lower threshold, least significant bits 0x14 rw ps_filter_config ps interrupt filter configuration 0x15 rw ps_config ps integration time configuration 0x16 rw ps_interval ps interval time configuration 0x17 rw ps_control ps operation mode control 0x40 r interrupt interrupt status 0x41 r ps_data_msb ps measurement data, most significant bits 0x42 r ps_data_lsb ps measurement data, least significant bits
noa2301 www. onsemi.com 11 part_id register (0x00) the part_id register provides part and revision identification. these values are hard?wired at the factory and cannot be modified. table 8. part_id register (0x00) bit 7 6 5 4 3 2 1 0 field part number id revision id field bit default description part number id 7:4 0101 part number identification revision id 3:0 na silicon revision number reset register (0x01) software reset is controlled by this register. setting this register followed by an i2c_stop sequence will immediately reset the noa2301 to the default startup standby state. t riggering the software reset has virtually the same ef fect as cycling the power supply tripping the internal power on reset (por) circuitry. table 9. reset register (0x01) bit 7 6 5 4 3 2 1 0 field na sw_reset field bit default description na 7:1 xxxxxxx don?t care sw_reset 0 0 software reset to startup state int_config register (0x02) int_config register controls the external interrupt pin function. table 10. int_config register (0x02) bit 7 6 5 4 3 2 1 0 field na edge_triggered auto_clear polarity field bit default description na 7:3 xxxxx don?t care edge_triggered 2 0 0 interrupt pin stays asserted while the interrupt register bit is set (level) 1 interrupt pin pulses at the end of each measurement while the interrupt register bit is set auto_clear 1 1 0 when an interrupt is triggered, the interrupt pin remains asserted until cleared by an i 2 c read of interrupt register 1 interrupt pin state is updated after each measurement polarity 0 0 0 interrupt pin active low when asserted 1 interrupt pin active high when asserted
noa2301 www. onsemi.com 12 ps_led_frequency register (0x0d) the led frequency register controls the frequency of the led pulses. the led modulation frequency is determined by dividing 4 mhz by the register value. valid divisors are 2?31. the default value is 16 which results in an led pulse frequency of 250 khz (one pulse every 4 s). table 11. ps_led_frequency register (0x0d) bit 7 6 5 4 3 2 1 0 field na led_modulation frequency field bit default description na 7:5 xxx don?t care led_modulation _frequency 4:0 10000 defines the divider of the 4mhz clock to generate the led pulses. valid values are 2?31 ps_sample_delay register (0x0e) the ps_sample_delay register controls the time delay after an led pulse edge before the resulting signal is sampled by the proximity sensor. this can be used to reduce the effect of noise caused by the led current switching. there is no delay for programmed values of 0x00 or 0x001. for other values the delay is (n?1)*125 ns, where n is the decimal value of the register. default value is 0x05 (500 ns). n must be less than or equal to the value in register 0x0d (ps_led_frequency). see the description of operation section for more information on programming this register. table 12. ps_sample_delay register (0x0e) bit 7 6 5 4 3 2 1 0 field na sample_delay field bit default description na 7:5 xxx don?t care sample_delay 4:0 00101 defines the delay from the led pulse edge before the pulse is sampled ps_led_current register (0x0f) the led_current register controls how much current the internal led driver sinks through the ir led during modulated illumination. the current sink range is 5 ma plus a binary weighted value of the led_current register times 5 ma, for an ef fective range of 10 ma to 160 ma in steps of 5 ma. the default setting is 50 ma. a register setting of 00 turns off the led driver. table 13. ps_led_current register (0x0f) bit 7 6 5 4 3 2 1 0 field na led_current field bit default description na 7:5 xxx don?t care led_current 4:0 01001 defines current sink during led modulation. binary weighted value times 5 ma plus 5 ma
noa2301 www. onsemi.com 13 ps_th registers (0x10 ? 0x13) with hysteresis not enabled (see ps_config register), the ps_th registers set the upper and lower interrupt thresholds of the proximity detection window. interrupt functions compare these threshold values to data from the ps_data registers. measured ps_data values outside this window will set an interrupt according to the int_config register settings. with hysteresis enabled, threshold settings take on a different meaning. if ps_hyst_trig is set, the ps_th_up register sets the upper threshold at which an interrupt will be set, while the ps_th_lo register then sets the lower threshold hysteresis value where the interrupt would be cleared. setting the ps_hyst_trig low reverses the function such that the ps_th_lo register sets the lower threshold at which an interrupt will be set and the ps_th_up represents the hysteresis value at which the interrupt would be subsequently cleared. hysteresis functions only apply in ?auto_clear? int_config mode. the controller software must ensure the settings for led current, sensitivity range, and integration time (led pulses) are appropriate for selected thresholds. setting thresholds to extremes (default) effectively disables interrupts. table 14. ps_th_up registers (0x10 ? 0x11) bit 7 6 5 4 3 2 1 0 field ps_th_up_msb(0x10), ps_th_up_lsb(0x11) field bit default description ps_th_up_msb 7:0 0xff upper threshold for proximity detection, msb ps_th_up_lsb 7:0 0xff upper threshold for proximity detection, lsb table 15. ps_th_lo registers (0x12 ? 0x13) bit 7 6 5 4 3 2 1 0 field ps_th_lo_msb(0x12), ps_th_lo_lsb(0x13) field bit default description ps_th_lo_msb 7:0 0x00 lower threshold for proximity detection, msb ps_th_lo_lsb 7:0 0x00 lower threshold for proximity detection, lsb ps_filter_config register (0x14) ps_filter_config register provides a hardware mechanism to filter out single event occurrences or similar anomalies from causing unwanted interrupts. two 4 bit registers (m and n) can be set with values such that m out of n measurements must exceed threshold settings in order to set an interrupt. the default setting of 1 out of 1 ef fectively turns the filter off and any single measurement exceeding thresholds can trigger an interrupt. n must be greater than or equal to m. a setting of 0 for either m or n is not allowed and disables the ps interrupt. table 16. ps_filter_config register (0x14) bit 7 6 5 4 3 2 1 0 field filter_n filter_m field bit default description filter_n 7:4 000 1 filter n filter_m 3:0 000 1 filter m
noa2301 www. onsemi.com 14 ps_config register (0x15) proximity measurement sensitivity is controlled by specifying the integration time. the integration time sets the number of led pulses during the modulated illumination. the led modulation frequency remains constant with a period of 1.5 s. changing the integration time affects the sensitivity of the detector and directly affects the power consumed by the led. the default is 1200 s integration period. hyst_enable and hyst_trigger work with the ps_th (threshold) settings to provide jitter control of the int function. table 17. ps_config register (0x15) bit 7 6 5 4 3 2 1 0 field na hyst_enable hyst_trigger na integration_time field bit default description na 7:6 xx don?t care hyst_enable 5 0 0 disables hysteresis 1 enables hysteresis hyst_trigger 4 0 0 lower threshold with hysteresis 1 upper threshold with hysteresis na 3 x don?t care integration_time 2:0 011 000 150 s integration time 001 300 s integration time 010 600 s integration time 011 1200 s integration time 100 1800 s integration time 101 2400 s integration time 110 3600 s integration time 111 4800 s integration time ps_interval register (0x16) the ps_interval register sets the wait time between consecutive proximity measurements in ps_repeat mode. the register is binary weighted times 10 in milliseconds plus 10 ms. the range is therefore 10 ms to 1.28 s. the default startup value is 0x04 (50 ms). table 18. ps_interval register (0x16) bit 7 6 5 4 3 2 1 0 field na interval field bit default description na 7 x don?t care interval 6:0 0x04 0x0 0 to 0x7f interval time between measurement cycles. binary weighted value times 10 ms plus a 10 ms offset.
noa2301 www. onsemi.com 15 ps_control register (0x17) the ps_control register is used to control the functional mode and commencement of proximity sensor measurements. the proximity sensor can be operated in either a single shot mode or consecutive measurements taken at programmable intervals. both single shot and repeat modes consume a minimum of power by immediately turning off led driver and sensor circuitry after each measurement. in both cases the quiescent current is less than the idd stby parameter. these automatic power management features eliminate the need for power down pins or special power down instructions. table 19. ps_control register (0x17) bit 7 6 5 4 3 2 1 0 field na ps_repeat ps_oneshot field bit default description na 7:2 xxxxxx don?t care ps_repeat 1 0 initiates new measurements at ps_interval rates ps_oneshot 0 0 triggers proximity sensing measurement. in single shot mode this bit clears itself after cycle completion. interrupt register (0x40) the interrupt register displays the status of the interrupt pin. if ?auto_clear? is disabled (see int_config register), reading this register also will clear the interrupt. table 20. interrupt register (0x40) bit 7 6 5 4 3 2 1 0 field na int ps_inth ps_intl field bit default description na 7:5 xxx don?t care int 4 0 status of external interrupt pin (1 is asserted) na 3:2 xx don?t care ps_inth 1 0 interrupt caused by ps exceeding maximum ps_intl 0 0 interrupt caused by ps falling below the minimum ps_data registers (0x41 ? 0x42) the ps_data registers store results from completed proximity measurements. when an i 2 c read operation begins, the current ps_data registers are locked until the operation is complete (i2c_stop received) to prevent possible data corruption from a concurrent measurement cycle. table 21. ps_data registers (0x41 ? 0x42) bit 7 6 5 4 3 2 1 0 field ps_data_msb(0x41), ps_data_lsb(0x42) field bit default description ps_data_msb 7:0 0x00 proximity measurement data, msb ps_data_lsb 7:0 0x00 proximity measurement data, lsb
noa2301 www. onsemi.com 16 proximity sensor operation noa2301 operation is divided into three phases: power up, configuration and operation. on power up the device initiates a reset which initializes the configuration registers to their default values and puts the device in the standby state. at any time, the host system may initiate a software reset by writing 0x01 to register 0x01. a software reset performs the same function as a power?on?reset. the configuration phase may be skipped if the default register values are acceptable, but typically it is desirable to change some or all of the configuration register values. configuration is accomplished by writing the desired configuration values to registers 0x02 through 0x17. writing to configuration registers can be done with either individual i 2 c byte?write commands or with one or more i 2 c block write commands. block write commands specify the first register address and then write multiple bytes of data in sequence. the noa2301 automatically increments the register address as it acknowledges each byte transfer. proximity sensor measurement is initiated by writing appropriate values to the control register (0x17). sending an i2c_stop sequence at the end of the write signals the internal state machines to wake up and begin the next measurement cycle. figure 14 and figure 15 illustrate the activity of key signals during a proximity sensor measurement cycle. the cycle begins by starting the precision oscillator and powering up the proximity sensor receiver. next, the ir led current is modulated according to the led current setting at the chosen led frequency and the values during both the on and off times of the led are stored (illuminated and ambient values). finally, the proximity reading is calculated by subtracting the ambient value from the illuminated value and storing the result in the 16 bit ps_data register. in one?shot mode, the ps receiver is then powered down and the oscillator is stopped. if repeat mode is set, the ps receiver is powered down for the specified interval and the process is repeated. with default configuration values (receiver integration time = 1200 s), the total measurement cycle will be less than 2 ms. 9 s i2c stop ps power 4mhz osc on led burst integration data available 50 ? 200 s ~600 s 8 clks 12 s integration time 0 ? 100 s 100 ? 150 s figure 14. proximity sensor one?shot timing interval (repeat) 9 s i2c stop ps power 4mhz osc on led burst integration data available 50 ? 200 s ~600 s 8 clks 12 s integration time 0 ? 100 s 100 ? 150 s figure 15. proximity sensor repeat timing
noa2301 www. onsemi.com 17 example programming sequence the following pseudo code configures the noa2301 proximity sensor in repeat mode with 50 ms wait time between each measurement and then runs it in an interrupt driven mode. when the controller receives an interrupt, the interrupt determines if the interrupts was caused by the proximity sensor and if so, reads the ps_data from the device, sets a flag and then waits for the main polling loop to respond to the proximity change. external subroutine i2c_read_byte (i2c_address, data_address); external subroutine i2c_read_block (i2c_address, data_start_address, count, memory_map); external subroutine i2c_write_byte (i2c_address, data_address, data); external subroutine i2c_write_block (i2c_address, data_start_address, count, memory_map); subroutine initialize_ps () { membuf[0x02] = 0x02; // int_config assert interrupt until cleared membuf[0x0f] = 0x09; // ps_led_current 50ma membuf[0x10] = 0x8f; // ps_th_up_msb membuf[0x11] = 0xff; // ps_th_up_lsb membuf[0x12] = 0x70; // ps_th_lo_msb membuf[0x13] = 0x00; // ps_th_lo_lsb membuf[0x14] = 0x11; // ps_filter_config turn off filtering membuf[0x15] = 0x09; // ps_config 300us integration time membuf[0x16] = 0x0a; // ps_interval 50ms wait membuf[0x17] = 0x02; // ps_control enable continuous ps measurements i2c_write_block (i2caddr, 0x02, 37, membuf); } subroutine i2c_interupt_handler () { // verify this is a ps interrupt int = i2c_read_byte (i2caddr, 0x40); if (int == 0x11 || int == 0x12) { // retrieve and store the ps data ps_data_msb = i2c_read_byte (i2caddr, 0x41); ps_data_lsb = i2c_read_byte (i2caddr, 0x42); newps = 0x01; } } subroutine main_loop () { i2caddr = 0x37; newps = 0x00; initialize_ps (); loop { // do some other polling operations if (newps == 0x01) { newps = 0x00; // do some operations with ps_data } } }
noa2301 www. onsemi.com 18 physical location of photodiode sensor the physical locations of the noa2301 proximity sensor photodiode is shown in figure 16 referenced to the lower left hand corner of the package. 0.836 mm 1.022 mm photodiode pin 1 0.15 mm 0.15 mm figure 16. photodiode locations
noa2301 www. onsemi.com 19 package dimensions cudfn8, 2x2, 0.5p case 505ap issue o mounting footprint* dimensions: millimeters *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 8x 0.47 0.50 pitch 1.55 2.30 8x 0.35 0.95 1 recommended notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 4. coplanarity applies to the exposed pad as well as the terminals. a d e b c 0.10 pin one reference 2x top view side view bottom view l d2 e2 c c 0.05 c 0.05 a1 seating plane 8x note 3 b 8x 0.10 c 0.05 c a b b dim min max millimeters a 0.55 0.65 a1 0.00 0.05 b 0.20 0.30 d 2.00 bsc d2 1.30 1.50 e 2.00 bsc e2 0.70 0.90 e 0.50 bsc 1 4 8 note 4 a l 0.25 0.35 e 5 generic marking diagram* (*note: clear package, no marking is present) e/2 c 0.10 2x on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 noa2301/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative ?

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